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Features and Specifications:
The EX58-UD3R was designed specifically to take advantage of the raw power of the next generation Intel Core i7 processors and the Intel X58 Express chipset, whose new evolution in computing architecture is able to deliver an amazing performance break through from past processor generations. Replacing the Front Side Bus is the new Quick Path Interconnect, or QPI, whose 25.6 GB/sec transfer rate (double the bandwidth of the 1600MHz FSB) eliminates the communication bottleneck between the processor and chipset. The Intel Core i7 processors also feature an integrated memory controller inside the processor die and support 192bit 3-channel DDR3 memory that delivers a 50% memory bandwidth enhancement and lower memory latency for incredibly fast memory access. Additionally, The EX58-UD3R features Intel Turbo Boost Technology, which is able to power down idle processor cores and dynamically reroute the power to the active cores for significant performance boosts, and at the same time, maintain greater energy efficiency. |
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Integrate Memory Controller Intel Core i7 Processors feature triple channel DDR3 support Intel Core i7 processors feature the memory controller integrated directly into the processor die, rather than as part of the Northbridge as in previous generations, allowing for faster memory performance. Core i7 processors also provide additional memory support including. |
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Replacing the role of FSB Intel uses the QPI to connect internal components of Core i7 processors , and to connect the CPU itself to the Northbridge and banks of memory. QPI delivers: Up to 25.6GB/sec of bandwidth between Core i7 processors and the rest of the system,providing exactly double the bandwidth of 1600 Hz FSB |
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Intel Turbo Boost Technology Dynamically reroutes power to improve performance. For situations when all cores are not needed for a particular workload, Intel Turbo Boost Technology powers down the idle cores and dynamically reroutes the power to the active cores, boosting their performance without wasting power. This allows the active cores to achieve significant overclocks. |
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ATI CrossFireX With support for ATI CrossFireX, GIGABYTE pushes the envelope once again by delivering highly optimized performance and flexibility demanded by power users and extreme gaming enthusiasts. Designed to provide unmatched multi-GPU support with dual PCI Express connectivity, the GA-EX58-UD3R allows users to take advantage of the ultra smooth 3D rendering, blazing-fast frame rates and enhanced visual quality possible with a dual graphics card solution. |
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Ultra Durable 3 Classic GIGABYTE Ultra Durable 3 Classic design, featuring 2 ounces of copper for both the Power and Ground layers which dramatically lowers system temperature by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. A 2oz Copper layer design also provides improved signal quality and lower EMI (Electromagnetic Interference), providing better system stability and allowing for greater margins for overclocking. |
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Benefits of 2 oz Copper PCB • Cooler than traditional motherboards • Enhanced durability • Improved energy efficiency • Greater margins for overclocking |
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2X Lower Impedance In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable 3 Classic motherboards, this means total PCB electrical waste is reduced by 50%, which also means less heat is generated. 2 ounces of copper also provides improved signal quality, providing better system stability and allowing for greater margins for overclocking. |
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50,000 Hours Japanese Solid Capacitors GIGABYTE Ultra Durable motherboards are equipped with solid capacitors developed by leading Japanese manufacturers. With an average life span of 50,000 hours, these solid capacitors provide the stability, reliability and longevity essential to meet the power needs of high-end processors and other components running today's most demanding applications and games. |
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Dynamic Energy Saver Advanced GIGABYTE Dynamic Energy Saver Advanced provides better energy saving capabilities and enhanced system performance. GIGABYTE Dynamic Energy Saver Advanced is the world’s only motherboard energy saving technology with hardware-based Dynamic 4-Gear Switching. GIGABYTE has also retooled Dynamic Energy Saver to allow overclockers to experience the benefits of multi-gear power phase switching while overclocking, providing ultra stable, ultra smooth overclocking performance. |
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DualBIOS - Patented Dual Hardware BIOS Protection DualBIOS is a GIGABYTE patented technology that automatically recovers BIOS data when main BIOS has crashed or failed. Featuring 2 physical BIOS ROMs integrated onboard, GIGABYTE DualBIOS allows quick and seamless recovery from BIOS damage or failure due to viruses or improper BIOS updating. |
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Hardware OverVoltage Control IC - Enabling Extreme Overclocking GIGABYTE Hardware Overvoltage Control ICs featuring more voltage control options than before for the CPU North Bridge and memory. The overvoltage controllers also provide hardware linear real-time voltage control, which means there is no delay compared to the GPIO controller in past implementations. In addition, GIGABYTE’s Hardware Overvoltage Controller ICs also allow for much finer voltage control, allowing power users to adjust voltage in as little increments as 20mV for better overclocking performance. |
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EasyTune6 GIGABYTE has completely redesigned EasyTune6 from the ground up to make it easier than ever to manage and monitor your hardware resources as well as tweak your system settings in order to achieve maximum system performance. Whether you are an overclocking enthusiast, or a computer novice, EasyTune6 provides the tools you need to quickly and effortlessly fine tune your system. |
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